Build Up Multi-Layer Board circuit board

 -. Mobile Phone    
 -. PDA    
 -. Digital Camera    
 -. Package(BGA,CSP)

Applications

10Layers : 0.030 Inches

8Layers : 0.024 Inches

Finished Board Thickness

Gold Plating, OSP

Gold Plating

Finished Surface Treatment

2 mils

4 mils

Outer Layer Line width/Space

2 mils

4 mils

Inner Layer Line width/Space

14 mils

20 mils

Via land Diameter

4 mils

8 mils

Via Hole Diameter

2 mils

2.4~3.2 mils

MIN. Dielectric Thickness

3 mils

4 ~ 6 mils

Laser Via Diameter

FR-4 / RCC

FR-4 / RCC

Base Material

Over than 10 L

4 ~ 8 L

Number of Layers

Proto Type

Mass Production

ITEM

Design Specification