Build Up Multi-Layer Board circuit board
Product Details
-. Mobile Phone
-. PDA
-. Digital Camera
-. Package(BGA,CSP)
Applications
10Layers : 0.030 Inches
8Layers : 0.024 Inches
Finished Board Thickness
Gold Plating, OSP
Gold Plating
Finished Surface Treatment
2 mils
4 mils
Outer Layer Line width/Space
2 mils
4 mils
Inner Layer Line width/Space
14 mils
20 mils
Via land Diameter
4 mils
8 mils
Via Hole Diameter
2 mils
2.4~3.2 mils
MIN. Dielectric Thickness
3 mils
4 ~ 6 mils
Laser Via Diameter
FR-4 / RCC
FR-4 / RCC
Base Material
Over than 10 L
4 ~ 8 L
Number of Layers
Proto Type
Mass Production
ITEM
Design Specification
- Country:South Korea
- telephone:82-031-494-4290
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Come From Shenzhen Xun Jie Xing Circuit Technology Co., Ltd.
