Technical SpecificationMinimum line width: 3. 5milMinimum line Spacing: 4milMinimum hole size: 0. 20mmMinimum Annular Ring: 5milMax Copper thickness: 6OZMax production size: 600X800mmBoard Thickness: Double Sides 0. 2-3. 0mm, Multilayers: 0. 40-6. 0 mmMin Solder Mask Bridge 0. 08mmPlugging Vias Capability: 0. 2-0. 8mmTolerance: Plated holes Tolerance: 0. 05mmNon-plated hole tolerance 0. 05mmOutline Tolerance: 0. 10mmFunctional test: Insulating resistance: 50 ohms (normality) Peel off strength: 1. 4n / mmThermal Stress test: 288, 10 secondsSolder mask hardness: 6HE-Test voltage: 10V-250VWarp and Twist: 0. 7% Surface finishing: OSP / immersion gold / flash gold / immersion silver / HAL
Technical Specification
Minimum line width: 3. 5mil
Minimum line Spacing: 4mil
Minimum hole size:
Model Number: | jx0007 |