8 Layer Impedance Control PCB
Product Details
Seal package
Special: Blind & buried +Impedance control
Min. line space: 0.1mm(4mil)
Min. line width:0.1mm(4mil)
Min. hole size:0.1mm(4mil)
Flash: ENIG
Thickness:1.0mm
Material:FR4
Layer:8 layer
Technological requirements
Soft gold, hard gold, immersion tin/gold, lead free HASL, Entek and hot air leveling are available for your orders.
- Certification:ISO9001:2000, ISO14001
- Model Number:HCC-PCB8018
- Brand Name:HCC
- Place of Origin:China
- Country:China (Mainland)
- telephone:86-755-86315155
| Delivery Time: | quick delivery |
| Package: | Vacuum |
| Supply Ability: | 20000 Square Meter per Month |
| Minimum Order Quantity: | 10 Piece/Pieces |
| Payment Terms: | L/C,D/P,T/T,Western Union |
| Port: | Shenzhen, Hongkong port |
| Fob Price: | US$10-1000Shenzhen, Hongkong port |
| Certification: | ISO9001:2000, ISO14001 |
| Model Number: | HCC-PCB8018 |
| Brand Name: | HCC |
| Place of Origin: | China |
Send inquiry / quota request to 8 Layer Impedance Control PCB
Relate products of 8 Layer Impedance Control PCB
Multilayer PCB Up to 64 Layers; FR4 TG135/TG150/TG170; Halogen Free/CTI≥600; Aspect Ratio (Finish Hole) 28:1; Sample Expedited 8 Hours(1-2Layer); HDI PCB Blind/Buried/Hybrid Via; 5+N(N+M)+5 Structure; Trace Width/Spacing 1.6/1.6mil; Laser Hole Size(mm)≥0.075; High Density ...
Come From Shenzhen PEAK Technology Co., Ltd
Number of layers: 8 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 4/3mil Inner layer W/S: 4/3mil Thickness: 1.2mm Min. hole diameter: 0.2mm Special process: impedance control Advantages Of 8 Layer PCB Own lamination process to convenient production for Multilayer PCB ...
Come From Xinfeng Huihe Circuits Co., Ltd.
Previous image Next image Number of layers: 10 Surface finish: ENIG Aspect Ratio: 8:1 Base material: FR4 Outer Layer W/S: 4/4mil Inner layer W/S: 5/3.5mil Thickness: 2.0mm Min. hole diameter:0.25mm Special process: Impedance Control, Resin Plugging, Different Copper Thickness ...
Come From Xinfeng Huihe Circuits Co., Ltd.
