Products involved fields: consume Electronics, Medical equipments, Industrial commands, communications, auto parts ect.
Min. parts footpins: 0201
Min. SMT Ptich: 12 mil (0.2 mm)
Surface Finish: Hard Gold / ENIG / HASL / Carbon Ink / OSP (ENTEK CU 106 AX) / Immersion Tin
Impedance: +/- 10%
Warpage: 0.5 %
Solder Mask: Solder Mask Bridge Between Solder Dam 3 mil (0.07 mm)
Micro Via: 4 mil (0.1 mm)
Hole to Edge Tolerance: +/- 5 mil (0.13 mm)
Hole to Hole Tolerance: +/- 3 mil (0.08 mm)
Minimum Via Size: 8 mil (0.2 mm)
Via / Drill Size: Minimum Drill Hole Diameter 10 mil (0.25 mm)
Layer to Layer Registration: +/- 5 mil (0.13 mm)
Maximum Thickness(10layers): 200 mil (5.0 mm)
Minimum Thickness (8 Layers): 24 mil (0.6 mm)
Minimum Thickness (6 Layers): 16 mil (0.4 mm)
Minimum Thickness (4 Layers): 12 mil (0.3 mm)
Minimum Thickness (2 Layers): 4 mil (0.1 mm)
Layer Count & Thickness: 2-12 layers
Minimum Line Spacing (External): 4 mil (0.1 mm) for mass production and 3 mils for samples.
Minimum Line Width (External): 4 mil (0.1 mm) for mass production and 3 mils for samples.
Minimum Line Width (Internal) 4 mil (0.1 mm) for mass production and 3mil for samples
Line Width & Spacing:
Maximum Panel Size: 26 X 26 (660mm X 660mm)
Material used: FR4, High Tg Minimum 170
We are a proffesional pcb and pcba manufacture in China,We can offer varies pcb and pcba as one unit.
Delivery Time: | 10--12Days |
Package: | Inner packing:vacuum packing /plastic bagOuter packing:standard carton packing |
Supply Ability: | 5000 Piece/Pieces per Month |
Minimum Order Quantity: | 1 Piece/Pieces |
Payment Terms: | T/T |
Port: | HK ,SHENZHEN |
Min. Line Width: | 0.1MM |
Min. Hole Size: | 0.2MM |
Board Thickness: | 1.8MM |
Copper Thickness: | 1OZ |
Base Material: | FR-4 |
Model Number: | JB177 |
Brand Name: | JB |
Place of Origin: | Guangdong China (Mainland) |
Multilayer PCB Up to 64 Layers; FR4 TG135/TG150/TG170; Halogen Free/CTI≥600; Aspect Ratio (Finish Hole) 28:1; Sample Expedited 8 Hours(1-2Layer); HDI PCB Blind/Buried/Hybrid Via; 5+N(N+M)+5 Structure; Trace Width/Spacing 1.6/1.6mil; Laser Hole Size(mm)≥0.075; High Density ...
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Previous image Next image Number of layers: 16 Surface finish: ENIG Base material: FR4 Thickness: 3.0mm Min. hole diameter:0.35mm size:420×560mm Outer Layer W/S: 4/3mil Inner layer W/S: 5/4mil Aspect Ratio: 9:1 Special process: via-in-pad Impedance Control Press Fit Hole ...
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Number of layers: 8 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 4/3mil Inner layer W/S: 5/4mil Thickness: 1.6mm Min. hole diameter: 0.2mm Special process: half hole Advantages Of 8 Layer ENIG Half Hole Custom Made PCB Own lamination process to convenient production ...
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Number of layers: 2 Surface finish: OSP Base material: FR4 Outer Layer W/S: 6/4mil Thickness: 1.0mm Min. hole diameter: 0.25mm Special process: impedance control+half hole Advantages Of 2 Layer OSP Impedance Control Half Hole PCB Own lamination process to convenient production ...
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Number of layers: 2 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 7/4mil Thickness: 1.0mm Min. hole diameter: 0.3mm Special process: impedance control+half hole Advantages Of 2 Layer ENIG Impedance Control Half Hole PCB Product Own lamination process to convenient ...
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Number of layers: 6 Surface finish: HASL Base material: FR4 Outer Layer W/S: 9/4mil Inner layer W/S: 11/7mil Thickness:1.6mm Min. hole diameter: 0.3mm Special process: Blind Vias Advantages Of 6 Layer HASL Blind Buried Via PCB Own lamination process to convenient production for ...
Come From Xinfeng Huihe Circuits Co., Ltd.