Process capacity |
Product category:single,dorble-sided/multi-layer(2-36)HASLPlated Goldlmmersion Gold/Tin/silver.HDL Multilayer PCB, Buried/Blind Via Board, High Frequency Board, Aluminum Base Board Flex-Rigid PCB, Teflon Board, and HDI |
Base materialFR-4,Alluminum, Non-halogen, Lead-free Compatibility ,High TG, High CTI,CEM-1,CEM-3,Teflon |
Max processing dimensions700mm |
Layer: 4 layer. Base material: FR-4;Drilled hole Dia:0.25mm;Min L/S: 5mil/5mil;Finish: immersion tin/white tin |