HDI Mobile Phone Rigid PCB

Layers: 6 Layers
Material: FR-4 ;
Thickness: 0.2-3.0mm;
Min.line width: 0.15mm;
Min.line space:0.15mm ;
Min.hole diameter:0.25mm ;
Max.board size:600*1200mm ;
Application:Cam350,pads2000,proter DXP;
Blind/buried via holes: OK;
Soldermask:green, blue, red, yellow, white, black etc
Surface craft: HAL, lead free, immersion gold, OSP, ENIG etc

HDI mobile phone printed circuit board:

HDI mobile phone PCB, Rigid PCB

  • Other Service:PCB Copy, parts assembly
  • Certification:ISO9001, ROHS
  • Soldermask: green, blue, red, yellow, white, bl...
  • Surface Finishing: HAL, lead free, immersion go...
  • Min. Line Spacing:0.15 mm
  • Min. Line Width:0.15 mm
  • Min. Hole Size:0.25mm
  • Board Thickness:0.2-3.0 mm
  • Copper Thickness:0.5-3 OZ
  • Base Material:FR4, TG
  • Brand Name:K-better, OEM
  • Place of Origin:Guangdong China (Mainland)
  • Country:China (Mainland)
  • telephone:86-755-82992189
Package: vacuum
Supply Ability: 30,000 Square Meter per Month
Minimum Order Quantity: 1 Piece/Pieces
Payment Terms: T/T,Western Union,MoneyGram
Port: Shenzhen
Min. Line Spacing: 0.15 mm
Min. Line Width: 0.15 mm
Min. Hole Size: 0.25mm
Board Thickness: 0.2-3.0 mm
Copper Thickness: 0.5-3 OZ
Base Material: FR4, TG
Brand Name: K-better, OEM
Place of Origin: Guangdong China (Mainland)
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