Process capacity |
Product category:single,dorble-sided/multi-layer(2-36)HASLPlated Goldlmmersion Gold/Tin/silver.HDL Multilayer PCB, Buried/Blind Via Board, High Frequency Board, Aluminum Base Board Flex-Rigid PCB, Teflon Board, and HDI |
Base materialFR-4,Alluminum, Non-halogen, Lead-free Compatibility ,High TG, High CTI,CEM-1,CEM-3,Teflon |
Max processing dimensions700mm |
Our monthly production capacity is currently 30,000 square meters. |
Specialty PCB Ceramic/Glass Material Hybrid Material Lamination Buried Capacitance/Resistance PTH/NPTH Step Slots Uneven/Segmented/Step Gold Finger Founded in 2007,PEAK ...
Come From Shenzhen PEAK Technology Co., Ltd
IC Substrate&Substrate-Like PCB CSP/FC-CSP/SIP/FC-BGA/WB-CSP FR4/BT/High-Speed Material Trace Width/Space 12/12μm SM Registration:±20μm Strict SM Flatness Control ≤5μm Founded in 2007,PEAK ...
Come From Shenzhen PEAK Technology Co., Ltd
Product Description JARCH Ultra Thin Disc Slip Ring PCB Substrate Mini Conductive Slip Rings for Robotic Arm Pancake slip rings are specially designed when length is at a premium but diameter is less restrictive; 2,3,4,6,8,10 circuits version In certain applications where a ...