Immersion gold pcb with BGA
Product Details
pcb. immersiongold, BGA
1.pcb with BGA, Immersiongold,
2.FR4( TG 170)
3.Immersiongold surface finish.
4.0.2mm hole size
- BGA:Immersiongold
- Place of Origin:Guangdong China (Mainland)
- Country:China (Mainland)
- telephone:86-755-26430572
| Delivery Time: | 24hours |
| Package: | Vacuum |
| Supply Ability: | 20000 Square Meter per Month |
| Minimum Order Quantity: | 1 Piece/Pieces |
| Payment Terms: | T/T |
| BGA: | Immersiongold |
| Place of Origin: | Guangdong China (Mainland) |
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Come From Shenzhen PEAK Technology Co., Ltd
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. ...
