RoHS Compliant
10 layers, Tg170 FR4
Board thickness: 1.6mm
1.0oz copper weight
BGA, Immersion Tin
Routing / Punching, V-cut
10 Layers, Tg170 FR4, BGA, Immersion tin
Certification: | RoHS, IPC-600 |
Surface Finishing: | BGA, Immersion Tin |
Board Thickness: | 1.6mm |
Copper Thickness: | 1.0oz |
Base Material: | Tg170 FR4 |
Brand Name: | OEM |
Place of Origin: | Guangdong China (Mainland) |
Multilayer PCB Up to 64 Layers; FR4 TG135/TG150/TG170; Halogen Free/CTI≥600; Aspect Ratio (Finish Hole) 28:1; Sample Expedited 8 Hours(1-2Layer); HDI PCB Blind/Buried/Hybrid Via; 5+N(N+M)+5 Structure; Trace Width/Spacing 1.6/1.6mil; Laser Hole Size(mm)≥0.075; High Density ...
Come From Shenzhen PEAK Technology Co., Ltd
6L, Tg180, Immersion Tin ***Contact Information*** Email: sales@glocom.com.tw Web: www.glocom.com.tw Youtube: https://www.youtube.com/watch?v=xDIJCEdm-kU ...
Come From GLOCOM Electronics Ltd.
Tg180, 2oz, Immersion Tin ***Contact Information*** Email: sales@glocom.com.tw Web: www.glocom.com.tw Youtube: https://www.youtube.com/watch?v=xDIJCEdm-kU ...
Come From GLOCOM Electronics Ltd.