Process capacity |
Product category:single,dorble-sided/multi-layer(2-36)HASLPlated Goldlmmersion Gold/Tin/silver.HDL Multilayer PCB, Buried/Blind Via Board, High Frequency Board, Aluminum Base Board Flex-Rigid PCB, Teflon Board, and HDI |
Base materialFR-4,Alluminum, Non-halogen, Lead-free Compatibility ,High TG, High CTI,CEM-1,CEM-3,Teflon |
Max processing dimensions700mm |
All kinds of Immersion Tin PCB,Our monthly production capacity is currently 30,000 square meters. |
Multilayer PCB Up to 64 Layers; FR4 TG135/TG150/TG170; Halogen Free/CTI≥600; Aspect Ratio (Finish Hole) 28:1; Sample Expedited 8 Hours(1-2Layer); HDI PCB Blind/Buried/Hybrid Via; 5+N(N+M)+5 Structure; Trace Width/Spacing 1.6/1.6mil; Laser Hole Size(mm)≥0.075; High Density ...
Come From Shenzhen PEAK Technology Co., Ltd
6L, Tg180, Immersion Tin ***Contact Information*** Email: sales@glocom.com.tw Web: www.glocom.com.tw Youtube: https://www.youtube.com/watch?v=xDIJCEdm-kU ...
Come From GLOCOM Electronics Ltd.
Tg180, 2oz, Immersion Tin ***Contact Information*** Email: sales@glocom.com.tw Web: www.glocom.com.tw Youtube: https://www.youtube.com/watch?v=xDIJCEdm-kU ...
Come From GLOCOM Electronics Ltd.