Process capacity |
Product category:single,dorble-sided/multi-layer(2-36)HASLPlated Goldlmmersion Gold/Tin/silver.HDL Multilayer PCB, Buried/Blind Via Board, High Frequency Board, Aluminum Base Board Flex-Rigid PCB, Teflon Board, and HDI |
Base materialFR-4,Alluminum, Non-halogen, Lead-free Compatibility ,High TG, High CTI,CEM-1,CEM-3,Teflon |
Max processing dimensions700mm |
All kinds of Gold Finger with HASL PCB,Our monthly production capacity is currently 30,000 square meters. |
Multilayer PCB Up to 64 Layers; FR4 TG135/TG150/TG170; Halogen Free/CTI≥600; Aspect Ratio (Finish Hole) 28:1; Sample Expedited 8 Hours(1-2Layer); HDI PCB Blind/Buried/Hybrid Via; 5+N(N+M)+5 Structure; Trace Width/Spacing 1.6/1.6mil; Laser Hole Size(mm)≥0.075; High Density ...
Come From Shenzhen PEAK Technology Co., Ltd
Number of layers: 2 size: 184.2*158.9mm Surface finish: LF-HASL Base material: Rogers 4350B Min. hole diameter: 0.4mm Minimum Line Width: 0.227mm Minimum Line Space: 0.127mm Thickness: 0.7mm Advantages Of 2 Layer Rogers LF-HASL PCB Own lamination process to convenient ...
Come From Xinfeng Huihe Circuits Co., Ltd.
Number of layers: 6 Surface finish: HASL Base material: FR4 Outer Layer W/S: 9/4mil Inner layer W/S: 11/7mil Thickness:1.6mm Min. hole diameter: 0.3mm Special process: Blind Vias Advantages Of 6 Layer HASL Blind Buried Via PCB Own lamination process to convenient production for ...
Come From Xinfeng Huihe Circuits Co., Ltd.