6 layer Rigid-Flex buried via pcb

surface finishing: immersion gold

copper size: rigid 1.5oz + flex 1oz

finish coating: 0.035mm


6 layer Rigid-Flex pcb baord
PI thickness: 0.21mm
surface treatment: Finger Electroplation Gold/ BGA Immersion gold: 0.21mm
surface treatment: Finger Electroplation Gold/ BGA Immersion gold

6 layer Rigid-Flex pcb baord
PI thickness: 0.21mm
surface treatment: Finger Electroplation Gold/ BGA Immersion gold

  • Surface Finishing:immersion gold
  • Min. Line Spacing:0.2mm
  • Min. Line Width:0.2mm
  • Min. Hole Size:0.2mm
  • Board Thickness:rigid 1.2mm+flex 0.21mm
  • Copper Thickness:rigid 1.5oz+flex 1oz
  • Base Material:FR-4
  • Number of Layers:6-Layer
  • Place of Origin:Guangdong, China (Mainland)
  • color:green,black,red
  • Country:China (Mainland)
  • telephone:0086-755-21638080
Delivery Time: depend on quantity
Package: seal packing
Supply Ability: 10000 Square Meter per Month
Minimum Order Quantity: 5 Piece/Pieces
Payment Terms: L/C,T/T,Western Union
Port: shen zhen
Fob Price: US$0.2-12shen zhen
Min. Line Width: 0.2mm
Min. Hole Size: 0.2mm
Board Thickness: rigid 1.2mm+flex 0.21mm
Copper Thickness: rigid 1.5oz+flex 1oz
Base Material: FR-4
Number of Layers: 6-Layer
Place of Origin: Guangdong, China (Mainland)
color: green,black,red
*Your name:
*Your Email:
*To:Shenzhen Xinjiaye Electronics Technology Co., Ltd.
*Subject:
*Message:
Enter between 20 to 3,000 characters. English only.     Characters Remaining: 0 / 3000
*Enter the secure code shown below Mfrbee security Image      Reload Image

We do inquire for you , please wait ...

6 Layer HASL Blind Buried Via PCB

Number of layers: 6 Surface finish: HASL Base material: FR4 Outer Layer W/S: 9/4mil Inner layer W/S: 11/7mil Thickness:1.6mm Min. hole diameter: 0.3mm Special process: Blind Vias Advantages Of 6 Layer HASL Blind Buried Via PCB Own lamination process to convenient production for ...

Come From Xinfeng Huihe Circuits Co., Ltd.

14 Layer Blind Buried Via PCB

Number of layers: 14 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 4/5mil Inner layer W/S: 4/3.5mil Thickness: 1.6mm Min. hole diameter: 0.2mm Special process: Blind & Buried Vias Advantages Of 14 Layer PCB Own lamination process to convenient production for ...

Come From Xinfeng Huihe Circuits Co., Ltd.

IoT Electric Circuit Board 6 Layers Rigid Flex PCB

Product type IoT Rigid Flex PCB Material FR4 PTFE, FR4 408HR, FR4 ROGERS, PI, PET, etc.. Supply ability 1-26 layers (Rigid 26, Flexible 12) Maximum board size 550*800mm Board thickness 0.2-6mm Min Line Space/Width 3mil/3mil Impedance tolerance ±8% Surface treatment OSP, HASL, ...

Come From Shenzhen Derek Tech Co., Ltd