HDI PCB(ROHS)
Product Details
Products involved fields: consume Electronics, Medical equipments, Industrial commands, communications, auto parts ect.
Min. parts footpins: 0201
Min. SMT Ptich: 12 mil (0.2 mm)
Surface Finish: Hard Gold / ENIG / HASL / Carbon Ink / OSP (ENTEK CU 106 AX) / Immersion Tin
Impedance: +/- 10%
Warpage: 0.5 %
Solder Mask: Solder Mask Bridge Between Solder Dam 3 mil (0.07 mm)
Micro Via: 4 mil (0.1 mm)
Hole to Edge Tolerance: +/- 5 mil (0.13 mm)
Hole to Hole Tolerance: +/- 3 mil (0.08 mm)
Minimum Via Size: 8 mil (0.2 mm)
Via / Drill Size: Minimum Drill Hole Diameter 10 mil (0.25 mm)
Layer to Layer Registration: +/- 5 mil (0.13 mm)
Maximum Thickness(10layers): 200 mil (5.0 mm)
Minimum Thickness (8 Layers): 24 mil (0.6 mm)
Minimum Thickness (6 Layers): 16 mil (0.4 mm)
Minimum Thickness (4 Layers): 12 mil (0.3 mm)
Minimum Thickness (2 Layers): 4 mil (0.1 mm)
Layer Count & Thickness: 2-12 layers
Minimum Line Spacing (External): 4 mil (0.1 mm) for mass production and 3 mils for samples.
Minimum Line Width (External): 4 mil (0.1 mm) for mass production and 3 mils for samples.
Minimum Line Width (Internal) 4 mil (0.1 mm) for mass production and 3mil for samples
Line Width & Spacing:
Maximum Panel Size: 26" X 26" (660mm X 660mm)
Material used: FR4, High Tg Minimum 170C, Hifrequency, Metal based: Aluminium ect.
Our PCB capability:
Surface finish: Hot Air Level
Solder mask type; Yellow
Min line space: 0.10mm
Min line width: 0.075mm
Board material type: FR4 board
Products involved fields: consume Electronics, Medical equipments, Industrial commands, communications, auto parts ect.
Min. parts footpins: 0201
Min. SMT Ptich: 12 mil (0.2 mm)
Surface Finish: Hard Gold / ENIG / HASL / Carbon Ink / OSP (ENTEK CU 106 AX) / Immersion Tin
Impedance: +/- 10%
Warpage: 0.5 %
Solder Mask: Solder Mask Bridge Between Solder Dam 3 mil (0.07 mm)
Micro Via: 4 mil (0.1 mm)
Hole to Edge Tolerance: +/- 5 mil (0.13 mm)
Hole to Hole Tolerance: +/- 3 mil (0.08 mm)
Minimum Via Size: 8 mil (0.2 mm)
Via / Drill Size: Minimum Drill Hole Diameter 10 mil (0.25 mm)
Layer to Layer Registration: +/- 5 mil (0.13 mm)
Maximum Thickness(10layers): 200 mil (5.0 mm)
Minimum Thickness (8 Layers): 24 mil (0.6 mm)
Minimum Thickness (6 Layers): 16 mil (0.4 mm)
Minimum Thickness (4 Layers): 12 mil (0.3 mm)
Minimum Thickness (2 Layers): 4 mil (0.1 mm)
Layer Count & Thickness: 2-12 layers
Minimum Line Spacing (External): 4 mil (0.1 mm) for mass production and 3 mils for samples.
Minimum Line Width (External): 4 mil (0.1 mm) for mass production and 3 mils for samples.
Minimum Line Width (Internal) 4 mil (0.1 mm) for mass production and 3mil for samples
Line Width & Spacing:
Maximum Panel Size: 26" X 26" (660mm X 660mm)
Material used: FR4, High Tg Minimum 170C, Hifrequency, Metal based: Aluminium ect.
Our PCB capability:
place sample order:7-9 days
mass production:10-12 days(the first time should add 2-3 days)
green soldermark
surface processing ;immersion gold
the smallest hole:0.15mm
min line space:0.13mm
min line width:0.13mm
ROHS&UL standard
thickness:1.0mm
material:FR4
layer:6
defect free parts, on-time delivery,achieving highest yields
- made in shenzhen:6 layer
- Surface Finishing:immersion gold
- Min. Line Spacing:0.13MM
- Min. Line Width:0.13MM
- Min. Hole Size:0.15MM
- Board Thickness:1.0MM
- Copper Thickness:1OZ
- Base Material:FR4
- Model Number:JB26A0
- Brand Name:JB
- Place of Origin:Guangdong China (Mainland)
- Country:China (Mainland)
- telephone:0086-755-26978081
| Delivery Time: | 6-8days |
| Package: | CNC |
| Supply Ability: | 20000 Cubic Meter per Month |
| Minimum Order Quantity: | 0 Cubic Meter |
| Payment Terms: | T/T |
| Port: | shenzhen |
| Fob Price: | US$1-99shenzhen |
| Min. Line Width: | 0.13MM |
| Min. Hole Size: | 0.15MM |
| Board Thickness: | 1.0MM |
| Copper Thickness: | 1OZ |
| Base Material: | FR4 |
| Model Number: | JB26A0 |
| Brand Name: | JB |
| Place of Origin: | Guangdong China (Mainland) |
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