2 layer PCB(ROHS)

Products involved fields: consume Electronics, Medical equipments, Industrial commands, communications, auto parts ect.

Min. parts footpins: 0201

Min. SMT Ptich: 12 mil (0.2 mm)

Surface Finish: Hard Gold / ENIG / HASL / Carbon Ink / OSP (ENTEK CU 106 AX) / Immersion Tin

Impedance: +/- 10%

Warpage: 0.5 %

Solder Mask: Solder Mask Bridge Between Solder Dam 3 mil (0.07 mm)

Micro Via: 4 mil (0.1 mm)

Hole to Edge Tolerance: +/- 5 mil (0.13 mm)

Hole to Hole Tolerance: +/- 3 mil (0.08 mm)

Minimum Via Size: 8 mil (0.2 mm)

Via / Drill Size: Minimum Drill Hole Diameter 10 mil (0.25 mm)

Layer to Layer Registration: +/- 5 mil (0.13 mm)

Maximum Thickness(10layers): 200 mil (5.0 mm)

Minimum Thickness (8 Layers): 24 mil (0.6 mm)

Minimum Thickness (6 Layers): 16 mil (0.4 mm)

Minimum Thickness (4 Layers): 12 mil (0.3 mm)

Minimum Thickness (2 Layers): 4 mil (0.1 mm)

Layer Count & Thickness: 2-12 layers

Minimum Line Spacing (External): 4 mil (0.1 mm) for mass production and 3 mils for samples.

Minimum Line Width (External): 4 mil (0.1 mm) for mass production and 3 mils for samples.

Minimum Line Width (Internal) 4 mil (0.1 mm) for mass production and 3mil for samples

Line Width & Spacing: 

Maximum Panel Size: 26" X 26" (660mm X 660mm)

Material used: FR4, High Tg Minimum 170C, Hifrequency, Metal based: Aluminium ect.

Our PCB capability:

Surface finish: Hot Air Level

Solder mask type; Yellow

Min line space: 0.10mm

Min line width: 0.075mm

Board material type: FR4 board

Products involved fields: consume Electronics, Medical equipments, Industrial commands, communications, auto parts ect.

Min. parts footpins: 0201

Min. SMT Ptich: 12 mil (0.2 mm)

Surface Finish: Hard Gold / ENIG / HASL / Carbon Ink / OSP (ENTEK CU 106 AX) / Immersion Tin

Impedance: +/- 10%

Warpage: 0.5 %

Solder Mask: Solder Mask Bridge Between Solder Dam 3 mil (0.07 mm)

Micro Via: 4 mil (0.1 mm)

Hole to Edge Tolerance: +/- 5 mil (0.13 mm)

Hole to Hole Tolerance: +/- 3 mil (0.08 mm)

Minimum Via Size: 8 mil (0.2 mm)

Via / Drill Size: Minimum Drill Hole Diameter 10 mil (0.25 mm)

Layer to Layer Registration: +/- 5 mil (0.13 mm)

Maximum Thickness(10layers): 200 mil (5.0 mm)

Minimum Thickness (8 Layers): 24 mil (0.6 mm)

Minimum Thickness (6 Layers): 16 mil (0.4 mm)

Minimum Thickness (4 Layers): 12 mil (0.3 mm)

Minimum Thickness (2 Layers): 4 mil (0.1 mm)

Layer Count & Thickness: 2-12 layers

Minimum Line Spacing (External): 4 mil (0.1 mm) for mass production and 3 mils for samples.

Minimum Line Width (External): 4 mil (0.1 mm) for mass production and 3 mils for samples.

Minimum Line Width (Internal) 4 mil (0.1 mm) for mass production and 3mil for samples

Line Width & Spacing: 

Maximum Panel Size: 26" X 26" (660mm X 660mm)

Material used: FR4, High Tg Minimum 170C, Hifrequency, Metal based: Aluminium ect.

Our PCB capability:

place sample order:3-5 days
mass production:7-9 days(the first time should add 2-3 days)

green soldermark

surface processing ;immersion gold

the smallest hole:0.2mm

min line space:0.1-O.3mm

min line width:0.1-0.3mm

ROHS&UL standard

thickness:1.75mm

material:FR4

layer:2

 

2 layer HDI PCB

  • Surface Finishing:immersion gold
  • Min. Line Spacing:4MIL
  • Min. Line Width:4MIL
  • Min. Hole Size:0.2MM
  • Board Thickness:1.75MM
  • Copper Thickness:1OZ
  • Base Material:FR4
  • Model Number:JB321A0
  • Brand Name:JB
  • Place of Origin:Guangdong China (Mainland)
  • Country:China (Mainland)
  • telephone:0086-755-26978081
Delivery Time: 3-5
Package: CNC
Supply Ability: 20000 Cubic Meter per Month
Minimum Order Quantity: 1 Cubic Meter
Payment Terms: T/T
Port: shenzhen
Fob Price: US$1-99shenzhen
Min. Line Width: 4MIL
Min. Hole Size: 0.2MM
Board Thickness: 1.75MM
Copper Thickness: 1OZ
Base Material: FR4
Model Number: JB321A0
Brand Name: JB
Place of Origin: Guangdong China (Mainland)
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