Our production capability Blind and Buried Via PCB
1.Layer:1-28 layers
2.Material:CME1,CME3,FR4,High TG FR4,Halogen-free FR4,Aluminium,Ceramic,PTFE(F4B,F4BK),Rogers(4003,4350,5880),Taconic,Arlon(35N,85N),etc
3.Material Mixed Laminate:12layers,FR4+Ro4350,FR4+Aluminium,FR4+FPC
4.Maximum size:1200mm*2000mm
5.Board Outline Tolerance:
Blind and Buried Via PCB,multilayer PCB,double sided PCB.
OEM and ODM PCB service.
PCB assembly service is available
Delivery Time: | 3-15days |
Package: | vacuum-packed,corrugated carton |
Minimum Order Quantity: | 10 Piece/Pieces |
Payment Terms: | T/T,Western Union |
Port: | Shenzhen or HK |
Min. Line Width: | 0.075mm |
Min. Hole Size: | 0.075mm |
Board Thickness: | 0.1-6.0mm |
Copper Thickness: | 0.5-6.0 OZ |
Base Material: | CME1,CME3,FR4,High TG FR4,Halogen-free FR4,Aluminium,Ceramic,PTFE |
Model Number: | Blind and Buried Via PCB |
Brand Name: | STC |
Place of Origin: | Guangdong China (Mainland) |
Number of layers: 6 Surface finish: HASL Base material: FR4 Outer Layer W/S: 9/4mil Inner layer W/S: 11/7mil Thickness:1.6mm Min. hole diameter: 0.3mm Special process: Blind Vias Advantages Of 6 Layer HASL Blind Buried Via PCB Own lamination process to convenient production for ...
Come From Xinfeng Huihe Circuits Co., Ltd.
Number of layers: 14 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 4/5mil Inner layer W/S: 4/3.5mil Thickness: 1.6mm Min. hole diameter: 0.2mm Special process: Blind & Buried Vias Advantages Of 14 Layer PCB Own lamination process to convenient production for ...
Come From Xinfeng Huihe Circuits Co., Ltd.
Buried vias PCB & blind vias PCB, use micro blind vias to increase the trace distribution density. Improve radio frequency, electromagnetic wave interference and hear conduction. Apply to computer server, mobile phone and digital camera products.HUIHE CIRCUITS is China HDI PCB ...
Come From Xinfeng Huihe Circuits Co., Ltd.