8 layer PCB(Printed Circuit Board) with blind holes
Product Details
PCB(Printed Circuit Board), short lead time
PN:J34655M8A
layer count:8
distance from hole to trace:8MIL
min hole:0.3MM
min trace width/gap:4/4.3mil
aspect ratio:7:1
board thickness:2.0MM+/-0.20MM
finished treatment:blind hole+ENIG+impedance
board size:350*99.6MM
difficult point:
L1-L3 blind hole,2 times pressing, hard to control warp and twist
blind hole from L1-3
ENG+gold finger
impedance control
min hole 0.2mm
PCB(Printed Circuit Board) short lead time
- Surface Finishing:ENIG+gold fingers+impedance
- Min. Line Spacing:4.3mil
- Min. Line Width:4mil
- Min. Hole Size:0.3mm
- Board Thickness:2.0mm
- Copper Thickness:1 OZ
- Base Material:FR-4
- Model Number:J34655M8A
- Brand Name:JX
- Place of Origin:Guangdong China (Mainland)
- Country:
- telephone:
| Minimum Order Quantity: | 2 Piece/Pieces |
| Payment Terms: | T/T |
| Port: | FOB Shen Zhen |
| Fob Price: | US$10-100FOB Shen Zhen |
| Min. Line Width: | 4mil |
| Min. Hole Size: | 0.3mm |
| Board Thickness: | 2.0mm |
| Copper Thickness: | 1 OZ |
| Base Material: | FR-4 |
| Model Number: | J34655M8A |
| Brand Name: | JX |
| Place of Origin: | Guangdong China (Mainland) |
Send inquiry / quota request to 8 layer PCB(Printed Circuit Board) with blind holes
Relate products of 8 layer PCB(Printed Circuit Board) with blind holes
Number of layers: 8 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 4/3mil Inner layer W/S: 5/4mil Thickness: 1.6mm Min. hole diameter: 0.2mm Special process: half hole Advantages Of 8 Layer ENIG Half Hole Custom Made PCB Own lamination process to convenient production ...
Come From Xinfeng Huihe Circuits Co., Ltd.
Number of layers: 4 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 6/4mil Inner layer W: 21mil Thickness: 0.4mm Min. hole diameter: 0.2mm Special process: impedance control+half hole Advantages Of 4 Layer ENIG Impedance Control Half Hole PCB Electric Circuit Board Own ...
Come From Xinfeng Huihe Circuits Co., Ltd.
Number of layers: 8 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 4/3.5mil Inner layer W/S: 4/3.5mil Thickness: 1.2mm Min. hole diameter: 0.2mm Special process: impedance control+half hole Advantages Of 8 Layer ENIG Impedance Control Half Hole PCB Own lamination ...
Come From Xinfeng Huihe Circuits Co., Ltd.
