impedance control PCB(Printed Circuit Board) with 0.2mm min holes

PCB(Printed Circuit Board), short lead time


PN:J32502M12A
layer count:12
board size:197X120mm
board thickness:2.0mm
finished treatment:HAL+impedance controll
min hole:0.2mm
min trace width/gap:5/4.7mil
aspect ratio:10:1
distance from hole to trace:8mil
difficult point:
1.min hole 0.2mm, aspect ratio:10:1,
2.hole to trace distance only 8mil,

used in MP3/MP4 products
min hole 0.2mm, aspect ratio:10:1
impedance control
PCB(Printed Circuit Board) with short lead time

try circuit board    to get through more products

  • Surface Finishing:HAL+impedance control
  • Min. Line Spacing:4.7mil
  • Min. Line Width:5mil
  • Min. Hole Size:0.2mm
  • Board Thickness:2.0mm
  • Copper Thickness:1 OZ
  • Base Material:FR-4
  • Model Number:J32502M12A
  • Brand Name:JX
  • Place of Origin:Guangdong China (Mainland)
  • Country:
  • telephone:
Minimum Order Quantity: 2 Piece/Pieces
Payment Terms: T/T
Port: FOB Shen Zhen
Fob Price: US$10-100FOB Shen Zhen
Min. Line Width: 5mil
Min. Hole Size: 0.2mm
Board Thickness: 2.0mm
Copper Thickness: 1 OZ
Base Material: FR-4
Model Number: J32502M12A
Brand Name: JX
Place of Origin: Guangdong China (Mainland)
*Your name:
*Your Email:
*To:Shenzhen Xun Jie Xing Circuit Technology Co., Ltd.
*Subject:
*Message:
Enter between 20 to 3,000 characters. English only.     Characters Remaining: 0 / 3000
*Enter the secure code shown below Mfrbee security Image      Reload Image

We do inquire for you , please wait ...

4 Layer ENIG Impedance Control Half Hole PCB Electric Circuit Board

Number of layers: 4 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 6/4mil Inner layer W: 21mil Thickness: 0.4mm Min. hole diameter: 0.2mm Special process: impedance control+half hole Advantages Of 4 Layer ENIG Impedance Control Half Hole PCB Electric Circuit Board Own ...

Come From Xinfeng Huihe Circuits Co., Ltd.

4 Layer ENIG Impedance Control Half Hole Fr4 PCB

Number of layers: 4 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 6/3.5mil Inner layer W/S: 6/4mil Thickness: 0.8mm Min. hole diameter: 0.28mm Special process: impedance control+half hole Advantages Of 4 Layer ENIG Impedance Control Half Hole Fr4 PCB Own lamination ...

Come From Xinfeng Huihe Circuits Co., Ltd.

2 Layer OSP Impedance Control Half Hole PCB

Number of layers: 2 Surface finish: OSP Base material: FR4 Outer Layer W/S: 6/4mil Thickness: 1.0mm Min. hole diameter: 0.25mm Special process: impedance control+half hole Advantages Of 2 Layer OSP Impedance Control Half Hole PCB Own lamination process to convenient production ...

Come From Xinfeng Huihe Circuits Co., Ltd.