Wafer Chipping Detector

Wafer Chipping Detector prevents wafers from being broken in advance by detecting any defects at the ends of semiconductor wafers. A high-resolution camera is used to film in a line. It detects any defects at the ends of wafer at a high speed.
 
Reduce photographing time by receiving pictures of the end of wafer in parallel
Increase the speed of processing images by mounting a high-performance CPU in parallel.
Acquire high-quality pictures using VGA class high-resolution color cameras.
Minimize devices and improve their movement by introducing Embedded Systems
Support network ports to monitor and manage devices remotely
 
 
Accuracy : 97 % or above
Repeatability : 98 % or above
Chipping Detection Size : 100 (0.1mm)
Wafer Chipping Detector
  • Country:South Korea
  • telephone:82-02-865-2700
Minimize devices and improve their movement by introducing Embedded Systems
Support network ports to monitor
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