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Minimize devices and improve their movement by introducing Embedded Systems Support network ports to monitor |
GELGOOG cassava chips making machine consisted of cassava peeling washing machine, slicing machine, blanching machine, cassava chips frying machine, deoiling machine and cassava chips packaging machine etc capacity ranges from 100kgs/hr, 200kg/hr, 300kgs/hr, 500kgs/hr etc. ...
Come From GELGOOG Machinery Co., Ltd
Supplier Back Thinning Diamond Grinding Wheel For Silicon Wafer Silicon wafer back grinding wheels are mainly used for the thinning and fine grinding of the silicon wafer. Coolant: Oil, emulsion workpiece processed: silicon wafer of discrete devices, integrated chips (IC) and ...
Come From More Super Hard company