CMOS Image Sensor

Have a great day!

I will be looking forward to reply from you. (Chinese is also available.)

For more information, please do not hesitate to contact me.

Hopefully, we can have profitable business relationship in this opportunity.

For the strong points I mentioned above, our package has been providing all over the world including Panasonic, Motorola etc and all our customers are satisfied with our products. I am sure that you will be one of them if you give us the chance to let you know what we have for this field. You may find out unlimited and unstoppable potentiality OptoPAC have.

 * At the moment we produce thinnest CMOS image sensor package in the world.

_{- All different kind of image sensors can be used for our Package.}

7.      Good Compatibility.

6.      Easier process. (Compared with the Shellcase products)

5.      Simpler structure ( Compared with the Shellcase products)

4.      Excellent electrical and thermal performance.(Flip chip Solder Joint)

3.      Minimized translation or rotation.(Self alignment), not measurable<5um.

2.      Excellent co-planarity (Image sensor/Glass) Typically<5um.

1.      Small Form Factor(And also providing some space for Lens holder)

Advantages for our products.

Recently, as the market of Image Sensor, Camera module is advanced very rapidly, webecome competitive with each other for the top of technology and quality within rapid distribution of Camera Phone, Digital Camera and other applications over the world. Under these circumstances, we will do our best for providing our customers with reliable products and services as the leader of WLCSP fields based on key technology and research.

OptoPAC Inc that design and develop WLCSP(Wafer Level Chip Scaled Package) for CMOS and CCD Image Sensor has been grown as a venture company since Oct 2003. Also OptoPAC is based on the innovative patent technologies and know-how in Image Sensor Package fields. We were the first to actualize WLCSP made use of 8" glass wafer based on the specific patent technologies. Finally, we provide our customers with the maximum satisfaction with competitive WLCSP through the price, size and reliability. Further more, almost all of Sensor wafer can be used for our package also, other our competitors can not. * WLCSP : Wafer Level Chip Scalded Package

I send you this message to let you know what we producing and what we have for you. Hopefully, you do not mind getting this message.

First of all, I would like to introduce myself. I am assistant manager in Overseas sales team, OptoPAC that specialized in the Image Sensor packaging.

It is my pleasure to reach you.

Dear Sirs and Madams, 

Our products that have been minimalized in the size and cost will be meet
Your all requests.