Image Sensor

- All different kind of image sensors can be used for our Package.

7.      Good Compatibility.

6.      Easier process. (Compared with the Shellcase products)

5.      Simpler structure ( Compared with the Shellcase products)

4.      Excellent electrical and thermal performance.(Flip chip Solder Joint)

3.      Minimized translation or rotation.(Self alignment), not measurable<5um.

2.      Excellent co-planarity (Image sensor/Glass) Typically<5um.

1.      Small Form Factor(And also providing some space for Lens holder)

Advantages for our products.

Recently, as the market of Image Sensor, Camera module is advanced very rapidly, webecome competitive with each other for the top of technology and quality within rapid distribution of Camera Phone, Digital Camera and other applications over the world. Under these circumstances, we will do our best for providing our customers with reliable products and services as the leader of WLCSP fields based on key technology and research.

* WLCSP : Wafer Level Chip Scalded Package

OptoPAC Inc that design and develop WLCSP(Wafer Level Chip Scaled Package) for CMOS and CCD Image Sensor has been grown as a venture company since Oct 2003. Also OptoPAC is based on the innovative patent technologies and know-how in Image Sensor Package fields. We were the first to actualize WLCSP made use of 8" glass wafer based on the specific patent technologies. Finally, we provide our customers with the maximum satisfaction with competitive WLCSP through the price, size and reliability. Further more, almost all of Sensor wafer can be used for our package also, other our competitors can not.

We have thinnest CMOS image sensor in the world.