220 +/- 10
Micron
Thickness
The Chohralsky
Cultivation method
Geometrical parametres:
(0,1-5)?1017
cm-3
Concentration of carbon, not more than
1?1018
cm-3
Concentration of oxygen, not more than
12
microsecond
Time of life, not less than
1- 3
Ohm?cm
Resistivity
Electrophysical parametres:
Value
Unit of measure
Parameter Quantity: 1000 kg Place of inspection: Moscow, Russia Origin: Russia We offer from our stock Monocrystalline silicon wafers, Bare. |
Type: hub dicing blade Brief introduction:electroformed hub dicing blade is used for cutting Silicon Wafers, copper wafer, IC/LED Packages, Compound Semiconductor Wafers (GaAs, Gap),Oxide Wafers (LiTaO3), Optical Glass Application: silicon wafer, copper wafer Details ...
Come From Henan More Super Hard Products Co Ltd
name: diamond backgrinding wheel application: silicon wafer Details Introduction of back grinding wheels: Diamond back grinding wheels are used for silicon wafer grinding. our advanced technology makes back grinding wheel possible to grind all types of semiconductor wafers with ...
Come From Henan More Super Hard Products Co Ltd
Supplier Back Thinning Diamond Grinding Wheel For Silicon Wafer Silicon wafer back grinding wheels are mainly used for the thinning and fine grinding of the silicon wafer. Coolant: Oil, emulsion workpiece processed: silicon wafer of discrete devices, integrated chips (IC) and ...
Come From More Super Hard company