Sell high speed 3d solder paste inspector @China (Mainland)

Measurement Principle	3D white light PSLM PMP
Measurements	volume,area,hight,XY,shape
FOV size	26×20mm(1.02×0.75 in.)
Accuracy	XY:10μm(0.39mils); Hight:±1μm(±0.04mils)
Repeatability	Hight:<1μm(4 Sigma), area:<1%(5 Sigma)
Detection Speed	<1.5s/FOV
Mark-point detection time	1s/pcs
Maximum Measuring height	700μm(27.5 mils)
Maximum Measuring height of PCB warp	±5mm (0.20 in.)
Minimum pad spacing	100μm(3.94 mils) (solder paste hight 150μm)
Smallest size measurement	rectangle:150μm(5.9 mils), circle:200μm(7.87 mils)
Maximum PCB Size	350×250mm(13.8×9.8 in.)
Engineering Statistics	Histogram, Xbar-R Chart, Xbar-S Chart,Cp & Cpk, % Gage Repeatability Data,SPI Daily/Weekly/Monthly Reports
Read position Detection	supportGerber Format(274x, 274d) Teach
Operating system support	Windows XP Professional&windows7 professional
Equipment Dimensionandeight	750×680×500 mm(30×27×20 in.) 75kg

Post by luke zhang Apparel @2012-05-30 15:40:51

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