Thermal interface materials or thermal pads are space saving solutions to managing heat. They are used to fill the gaps between heat sinks and microprocessors. Even when not seen by the naked eye, microscopic air bubbles can be present in this space between the components, which when heated can harm the long term productivity and lifespan of the entire product. Intermark’s thermal pad series are the solutions that prevent these air gaps from harming your system’s components while maintaining excellent thermal conductivity.
Intermark USA Inc’s Qoolite™ TH, IMTH series, silicone-based thermal pads are popular items for many applications such as cell phones, laptop, routers, network servers etc.
Standard Silicone-Base Thermal Pads Qoolite™ TH – IMTH50 Series
http://intermark-usa.com/products/thermal-pads-and-thermal-management/thermal-pads-imth50-series/
Other Thermal Pad Products
http://intermark-usa.com/products/thermal-pads-and-thermal-management/
Post by Sales Div. Computer Hardware & Software @2012-12-11 07:15:52