Sell microchannel cooler @China (Mainland)
Product Description
The particular internal micro processing technology realizes the low heat resistance and the optical CTE of the LD loading surface.Presavative treatment is conducted on the inner portion of the flow path so that the corrosion resistance of products is proved.
Product Feature
(A) capable of loading 120W level LD
(B) realization of longevity of LD drive
(C) control CTE of the LD bonding area
(D) the inner portion of the flow path is plated with Au so that corrosion resistance is proved
(E) capable of conducting AuSn prefabrication on the LD bonding area
Product Specification/Models
(A) 11.0*20.0*1.55(mm) single- layer
(B) 11.0*27.0*1.55(mm) muti-layer
(heatsinks,heat spreader,laser diode submount substrates,optoelectronics packages,copper tunsten substrate,base plate,flange,chip carrier,optical bench,Au/Sn solder alloy,laser diode bar bonding,semiconductor laser diode heat spreader,chips on laser diode submount)
The particular internal micro processing technology realizes the low heat resistance and the optical CTE of the LD loading surface.Presavative treatment is conducted on the inner portion of the flow path so that the corrosion resistance of products is proved.
Product Feature
(A) capable of loading 120W level LD
(B) realization of longevity of LD drive
(C) control CTE of the LD bonding area
(D) the inner portion of the flow path is plated with Au so that corrosion resistance is proved
(E) capable of conducting AuSn prefabrication on the LD bonding area
Product Specification/Models
(A) 11.0*20.0*1.55(mm) single- layer
(B) 11.0*27.0*1.55(mm) muti-layer
(heatsinks,heat spreader,laser diode submount substrates,optoelectronics packages,copper tunsten substrate,base plate,flange,chip carrier,optical bench,Au/Sn solder alloy,laser diode bar bonding,semiconductor laser diode heat spreader,chips on laser diode submount)
Post by wayne wayne Electronic Components & Supplies @2015-10-26 14:48:02
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- ShaoYaoJu , ChaoYang district , Beijing , China