NO | Item | Parameter |
01 | Suitable object | DCB |
02 | Object size | Max:190×140mm; |
03 | Sample thickness | 1-2mm |
04 | CCDPixel |
AOI 1:13um/Pixel
AOI 2/3:24um/Pixel |
05 | Board warpsolution | Auto focus |
06 | CAM format | Gerber |
07 | Image Processingmethod | CCDColor software |
08 | InspectingSpeed | 9.6s/pcs |
09 | Data source | CAM+graphic scanning |
10 | Auxiliary function | Laser marking |
11 | Defect Confirmation | AOIon-line |
12 | Positioning Way ofceramic substrate | Automatic |
13 | Defectsearching method | Image contrast+ logic algorithm |
14 | Detectable flaw |
AOI 1:short-circuit,connecting line, chipped edge,residual copper,copper deficiency, copper surface stain, copper
surface oxidation,cutting dislocation, ink disconnection, ink shedding, ink contamination,reverseresistance welding
mark,resistance weldingdislocation,resistance weldingpinhole., etc .
AOI 2:dint, scratches,wrinkles, bumps; AOI 3:bubble,indentation; |