PCB Assembly Service

HX Electronic Technology Co.Ltd isone of professionalPCBfabrication suppliers

PCBA Technology Development

Vigorous development of high-density interconnection technology: HDI concentrates on the most advanced technology of contemporary PCB, which brings fine wire and tiny aperture to PCB.

Strong vitality of component embedding technology: component embedding technology is a huge change in PCB functional integrated circuits. PCB manufacturers have to invest more resources in the system, including design, equipment, testing, simulation, to maintain a strong vitality.

PCB materials that meet international standards: high heat resistance, high glass transition temperature (Tg), low coefficient of thermal expansion, and small dielectric constant.

Optoelectronic PCB has a promising future:PCBA oem technology uses the optical path layer and circuit layer to transmit signals, and the key to this new technology is the manufacture of the optical path layer (optical waveguide layer). It is an organic polymer that is formed by using lithographic photocopying, laser ablation, and reactive ion etching.

Update the manufacturing process and introduce advanced production equipment.

What is PCB Assembly Services

PCB assembly (pc board assembly) is one of the most important steps in PCB fabrication which includes all the components of manufacturing the complete PCB. There are two ways to make a pc board assembly; namely, Surface Mount Technique (SMT) and Through-Hole Technique (THT). SMT is a circuit assembly technology in which the pinless or short-lead surface-mounted components (SMC/SMD) are mounted on the surface of a Printed Circuit Board (PCB) or other substrate and assembled by soldering through reflow or dip soldering methods. THT uses leaded components with circuit connection leads and mounting holes designed on the printed board, and establishes long-term mechanical and electrical connections by inserting the component leads into the through-holes reserved on the PCB, temporarily fixing them and then soldering them on the other side of the substrate to form reliable solder joints.

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