Al2O3 Sputtering Target
Grade:99.99%
Chemical Composition:
1.Al2O3 Target, Purity (wt%) 99.99% min
2.Impurity Content: Unit PPm
Element Fe Cu Pb Cd Ni Mn K Na Ca Sb Mg Si
Content 6 5 7 6 5 5 3 4 8 6 8 10
Density:
1.Density of target: 3.89g/cm3 min
2.Relative densityof target: 98% min
Target color: White
Shape: Square/Round, According to your request
Max Size: 400mm; 400× 250× 15mm or as customer'request.
Customization is available
SPUTTERING TARGET BONDING Sputtering target bonding is a process that involves attaching a sputtering target to a backing plate or a substrate holder. The bonding process is crucial in ensuring smooth and efficient sputtering operations. The target material is typically bonded ...
Sputtering target bonding is a process that involves attaching a sputtering target to a backing plate or a substrate holder. The bonding process is crucial in ensuring smooth and efficient sputtering operations. The target material is typically bonded to a metallic or ceramic ...
Metal sputtering targets are critical components of the sputtering process used in the manufacturing of thin films for semiconductor and other advanced applications. These targets are high-purity metals or alloys with specific chemical compositions, and they are subjected to ...