LPM-1 laser treatment micro cluster perforation laser equipment

IPMs laser cluster material treatment perforation technology

LPM-1 is patent granted by DE102004001327 operates with quadruple Co2 or other laser types, beam inputs up to 4 Kilowatt to supply a high power twin level, vacuum operates multiplexer.

High spins of quad laser beams generates up to 200 individual optical output channels to supply special made flexible hollow fibers HCW, HWG, fiber optics, to archive micro perforation rows cross moving web or static material, combines automatic positioned laser perforation heads, each with motor driven focus.

Web speeds up to 400 m/min, web widths up to 2,000mm, up to 2,500,000 holes per second, jumbo roll-by-roll production, optical in-line permeability scanner control for perforation line position and quality, porosity feedback, hi-tech automation level and other features. Each laser micro perforation lines can archive 100 up to 1,000 C.U.

Outstanding product applications
For web or sheet material, metal, isolation, foil, film, plastic, substrate, leather, textile and paper enables now large number of possibilities for micro hole position, different pattern, design, wave, zigzag, cryptograms, scripts, marking, scribing, scratching, tear off lines or others which generates.

E.g. optimize air distribution characteristics into cigarette filters, unique anti counterfeiting piracy indication and not countable product advantages.

Special remark creates fundamentally new product properties, e.g. as final products for mouthpieces with tipping paper at cigarettes or other tobacco, packaging, security products, flip off or hinge-lid packs.

Specific indication of brand names to recognizable for everyone and even for product buyers, if micro design, holes, patterns, holograms are to see with magnified views only.

Or sensitive touch able as Braille scripts generated by micro cluster cryptograms or holograms.

MLL-1 targets many existent and new applications with high speed scans of laser beam divert in horizontal or vertical position.

Sophisticated ultra high-speed spins optical divert elements allows low budget modifications at existent systems and production machines.

Micro-Laser-Line technology means real alternative for high speed galvanometer scanner to archive micro cluster perforation, pattern design, waves, zigzag, packages line, cryptogram, company logo, hologram, anti counterfeit piracy contours for security paper, safety, bank notes, cards, metal sticker, printing, laminating, coating.

Fruit, food, bread, vegetable, agriculture covering, transparent films, plastic sheets, holographic paper, cigarette, tipping, filter, aluminum foil, shrinkable film, tear tapes, label, cardboard, matrix, marking, scribing, automotive, pharmacy, smoking, chemical or medical products, electronics part, chips, indicators, writing contours or profiles, embossing or holographic.

The patent of devise, process and product properties are pending as DE102004012081.

Other industry fields
The conception of high power twin level laser beam multiplexer enables plenty options in other industry application fields as cutting, cut-off, welding, surface finishing, drilling, ablation, cleaning, micromachining, polishing, forming, melting, surface treatment, roughness improvement.

Each of 200 single laser beam and coupled flexible hollow fiber HWG HCW up to 3,000mm length allows treatment processes or perforation heads for precise, compact, robotic positioning in X/Y direction of running web or static placed sheet material.

Automatic PLC controlled processes, equipments and devices enables now outstanding possibilities in industry, metal, plastic, domestic, tobacco product, medical, hygienic, wall covering, security cards, bank notes or food application.

LPM-1 means cluster material treatment at wide web, large area, surface or whole material treatment, high power twin or quad rotation laser beam splitter, mirror into a vacuum twin level multiplexer, Co2, YAG, Fiber, Excimer, UV laser with multiple optical inputs, flexible wave guide hollow fibers, HCW, HWG up to 200 output channels.

Material treatment and robotic handling for stainless steel, ceramic, aluminum, wafer, glass, ceramic, brass, copper, wafer, silicon, plastic sheets, titanium, jewelry, silicon, solar, panel, photovoltaic, micromachining, slitting, rewinding, refining, hybrid laser cutting machines or stand along systems.

LASER high speed MULTIPLEXER PERFORATION technology LPM-1 operates with twin or quad laser beam inputs, each of 2/4 Kilowatt