Type: hub dicing blade Brief introduction:electroformed hub dicing blade is used for cutting Silicon Wafers, copper wafer, IC/LED Packages, Compound Semiconductor Wafers (GaAs, Gap),Oxide Wafers (LiTaO3), Optical Glass Application: silicon wafer, copper wafer Details ...
Henan More Super Hard Products Co Ltd [Hardware] [Abrasive Tools] [2018-09-17 16:59:18 ]
name: diamond backgrinding wheel application: silicon wafer Details Introduction of back grinding wheels: Diamond back grinding wheels are used for silicon wafer grinding. our advanced technology makes back grinding wheel possible to grind all types of semiconductor wafers with ...
Henan More Super Hard Products Co Ltd [Hardware] [Abrasive Tools] [2018-09-06 15:22:00 ]
Supplier Back Thinning Diamond Grinding Wheel For Silicon Wafer Silicon wafer back grinding wheels are mainly used for the thinning and fine grinding of the silicon wafer. Coolant: Oil, emulsion workpiece processed: silicon wafer of discrete devices, integrated chips (IC) and ...
More Super Hard company [Hardware] [Abrasive Tools] [2018-07-13 11:37:07 ]
solar wafer 156*156 polysilicion ...
Zhenjiang Greatwall Group Co., Ltd. [Hardware] [Fasteners]
Laser Type:YAG Application:Laser Scribing Model Number:YMS-50&YMS-10D Brand Name:YUEMAO LASER Place of Origin:Guangdong China (Mainland) Silicon Wafer Laser Cutting Machine is used for silicon wafer(max.1.5mm) cutting in semiconductor industry and solar PV industry ...
Zhuhai Yuemao Laser Facility Engineering Co., Ltd. [General Industrial Equipment] [Laser Equipment]
Appearance:Crystalline metal We offer pot scrap derived from silicon ingot growts, from IC and solar grade. Also polysilicon, broken wafers, tps and tails ...
Sun Wind LTD [Minerals & Metallurgy] [Metal Scrap]
Place of Origin:Saudi Arabia We are the trader of Mill Scale, silicon mangnese, aluminum oxide, silicon wafers ...
PEARL IMPEX [Minerals & Metallurgy] [Metal Scrap]
Brand Name:silicon wafer ic grade Place of Origin:United Kingdom Broken and whole scrap ic grade silicon wafer ...
Tradeitchina limited [Minerals & Metallurgy] [Metal Scrap]
220 +/- 10 Micron Thickness The Chohralsky Cultivation method Geometrical parametres: (0,1-5)?1017 cm-3 Concentration of carbon, not more than 1?1018 cm-3 Concentration of oxygen, not more than 12 microsecond Time of life, not less than 1- 3 Ohm?cm Resistivity Electrophysical ...
ARTEKA S.A. [Minerals & Metallurgy] [Metal Scrap]
Model Number:SWW001 Silicon Wafer Bare and Coated P & N Type mixed more is P-type: 1, 200mm Quantity 4298 pieces Res ...
Recycle Silicon [Energy] [Solar Energy Products]
Place of Origin:China Specifications: 1) High fT 2) Short Ton-off 3) Low leakage current ...
Yangzhou Genesis Microelectronics Co., Ltd. [Electronic Components & Supplies] [Active Components]
Place of Origin:China Specifications: 1) High fT 2) Short Ton-off 3) Low leakage current ...
Yangzhou Genesis Microelectronics Co., Ltd. [Electronic Components & Supplies] [Active Components]
Place of Origin:China Specifications: 1) High power resistance for second breakdown, 2) Linear hFE, 3) Low leakage current ...
Yangzhou Genesis Microelectronics Co., Ltd. [Electronic Components & Supplies] [Active Components]
Place of Origin:China Specifications: 1) High power resistance for second breakdown, 2) Low leakage current ...
Yangzhou Genesis Microelectronics Co., Ltd. [Electronic Components & Supplies] [Active Components]
Place of Origin:China Specifications: 1) High power resistance for second breakdown, 2) Linear hFE, 3) Low leakage current ...
Yangzhou Genesis Microelectronics Co., Ltd. [Electronic Components & Supplies] [Active Components]
Place of Origin:China Specifications: 1) High power resistance for second breakdown, 2) Linear hFE, 3) Low leakage current ...
Yangzhou Genesis Microelectronics Co., Ltd. [Electronic Components & Supplies] [Active Components]
Place of Origin:China Specifications: 1) High power resistance for second breakdown 2) High fT 3) Linear hFE 4) Low VCE (SAT) ...
Yangzhou Genesis Microelectronics Co., Ltd. [Electronic Components & Supplies] [Active Components]
X-FAB is the worlds largest analog/mixed-signal foundry group manufacturing silicon wafers for mixed-signal integrated circuits (ICs). Its marketing network and client base span the Americas, Europe and Asia, offering manufacturing capacity of approximately 840,000 ...
X-FAB Semiconductor Foundries [Electronic Components & Supplies] [Active Components]
Package Dimensions:DO-35 Max. Reverse Current:0.005mA Max. Forward Current:150mA Max. Reverse Voltage:100V Max. Forward Voltage:1V Package Type:Surface Mount Type:Switching Diode Model Number:IN4448 Brand Name:ZhongBao Place of Origin:Jiangsu China (Mainland) silicon switching ...
Nanjing Wanteng Technology Development Co., Ltd. [Electronic Components & Supplies] [Active Components]
Package Dimensions:MiNiMELF Max. Reverse Current:0.005mA Max. Forward Current:150mA Max. Reverse Voltage:100V Max. Forward Voltage:1V Package Type:Surface Mount Type:Switching Diode Model Number:LL4448 Brand Name:ZhongBao Place of Origin:Jiangsu China (Mainland) silicon ...
Nanjing Wanteng Technology Development Co., Ltd. [Electronic Components & Supplies] [Active Components]
