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FPC Production Capabilities
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Layers
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1-8layers (soft & hard combined version is 8 layers)
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Finished Board Thickness
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Min.:10x45mm Max.:250x1200mm
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Available Laminates Material
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PI.PET,FR4-PI
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Finished Board Thickness tolerance
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±0.01mm
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Finished hole diameter(Min.)
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0.1mm
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Finished hole diameter(Max)
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0.6mm
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NPTH Hole diameter tolerance
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±0.025mm
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PTH hole diameter tolerance
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±0.050mm
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Copper foil thickness
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12um,18um,35um,70um
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Circuit width/spacing(Min.)
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≥0.065mm(1/2oz) ≥0.05mm(1/3oz)
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Surface Finished type
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OSP.Gold plating,Immersion Gold,Tin plating(lead free)etc.
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Gold Flash Ni/Au thickness
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Ni:2.54-9um Au:0.025-0.5um
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Immersion Tin thickness
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0.7-1.2um
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Tin plating thickness
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3-15um
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Drill hole position tolerance
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±0.05mm
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Punching dimension tolerance
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±0.05mm
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Certificate
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ROHS,UL,ISO9001 etc
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