1.Detailed Specification of PCB Manufacturing
1 | Layer | 1-30 layer |
2 | Material | FR-4,CEM-1,CEM-3,Hight TG,FR4 Halogen Free,FR-1,FR-2,Aluminum |
3 | Board thickness | 0.2mm-7mm |
4 | Max.finished board side | 500mm*500mm |
5 | Min.drilled hole size | 0.25mm |
6 | Min.line width | 0.075mm(3mil) |
7 | Min.line spaceing | 0.075mm(3mil) |
8 | Surface finish/treatment | HALS/HALS lead free,Chemical tin,Chemical Gold,Immersion gold Inmersion Silver/Gold,Osp,Gold Plating |
9 | Copper thickness | 0.5-4.0oz |
10 | Solder mask color | green/black/white/red/blue/yellow |
11 | Inner packing | Vacuum packing,Plastic bag |
12 | Outer packing | Standard carton packing |
13 | Hole tolerance | PTH:±0.076,NTPH:±0.05 |
14 | Certificate | UL,ISO9001,ISO14001,ROHS,CQC |
15 | Profiling Punching | Routing,V-CUT,Beveling |
16 | Assembly Service | Providing OEM service to all sorts of printed circuit board assembly |
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