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gold PCB Board for electronic products

Product Quick Detail

Packaging
Packaging Detail: Anti-static bag, bubble pack, carton box,Vacuum...
Delivery
15 Days

Specifications


F

FPC Production Capabilities

Layers 1-8layers (soft & hard combined version is 8 layers)
Finished Board Thickness Min.:10x45mm Max.:250x1200mm
Available Laminates Material PI.PET,FR4-PI
Finished Board Thickness tolerance ±0.01mm
Finished hole diameter(Min.) 0.1mm
Finished hole diameter(Max) 0.6mm
NPTH Hole diameter tolerance ±0.025mm
PTH hole diameter tolerance ±0.050mm
Copper foil thickness 12um,18um,35um,70um
Circuit width/spacing(Min.) ≥0.065mm(1/2oz) ≥0.05mm(1/3oz)
Surface Finished type OSP.Gold plating,Immersion Gold,Tin plating(lead free)etc.
Gold Flash Ni/Au thickness Ni:2.54-9um Au:0.025-0.5um
Immersion Tin thickness 0.7-1.2um
Tin plating thickness 3-15um
Drill hole position tolerance ±0.05mm
Punching dimension tolerance ±0.05mm
Certificate ROHS,UL,ISO9001 etc

Shenzhen jesen industrial Co.,LTD.

  • Country: China (Mainland)
  • Business Type: Shenzhen jesen industrial Co.,LTD.
  • Market:新兴市场
  • Founded Year:2010
  • Address:RmB26,Fenglin International Business Centre,Jixiang Mid_Rd,Longgang,Shenzhen
  • Contact:joe ma
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