1.Detailed Specification of PCB Manufacturing
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1
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Layer
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1-30 layer
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2
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Material
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FR-4,CEM-1,CEM-3,Hight TG,FR4 Halogen Free,FR-1,FR-2,Aluminum
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3
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Board thickness
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0.2mm-7mm
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4
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Max.finished board side
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500mm*500mm
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5
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Min.drilled hole size
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0.25mm
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6
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Min.line width
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0.075mm(3mil)
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7
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Min.line spaceing
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0.075mm(3mil)
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8
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Surface finish/treatment
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HALS/HALS lead free,Chemical tin,Chemical Gold,Immersion gold Inmersion Silver/Gold,Osp,Gold Plating
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9
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Copper thickness
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0.5-4.0oz
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10
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Solder mask color
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green/black/white/red/blue/yellow
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11
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Inner packing
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Vacuum packing,Plastic bag
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12
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Outer packing
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Standard carton packing
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13
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Hole tolerance
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PTH:±0.076,NTPH:±0.05
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14
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Certificate
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UL,ISO9001,ISO14001,ROHS,CQC
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15
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Profiling Punching
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Routing,V-CUT,Beveling
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16
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Assembly Service
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Providing OEM service to all sorts of printed circuit board assembly
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