1.Detailed Specification of PCB Manufacturing
1
|
Layer
|
1-30 layer
|
2
|
Material
|
FR-4,CEM-1,CEM-3,Hight TG,FR4 Halogen Free,FR-1,FR-2,Aluminum
|
3
|
Board thickness
|
0.2mm-7mm
|
4
|
Max.finished board side
|
500mm*500mm
|
5
|
Min.drilled hole size
|
0.25mm
|
6
|
Min.line width
|
0.075mm(3mil)
|
7
|
Min.line spaceing
|
0.075mm(3mil)
|
8
|
Surface finish/treatment
|
HALS/HALS lead free,Chemical tin,Chemical Gold,Immersion gold Inmersion Silver/Gold,Osp,Gold Plating
|
9
|
Copper thickness
|
0.5-4.0oz
|
10
|
Solder mask color
|
green/black/white/red/blue/yellow
|
11
|
Inner packing
|
Vacuum packing,Plastic bag
|
12
|
Outer packing
|
Standard carton packing
|
13
|
Hole tolerance
|
PTH:±0.076,NTPH:±0.05
|
14
|
Certificate
|
UL,ISO9001,ISO14001,ROHS,CQC
|
15
|
Profiling Punching
|
Routing,V-CUT,Beveling
|
16
|
Assembly Service
|
Providing OEM service to all sorts of printed circuit board assembly
|
|