Number of layers: 14 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 4/5mil Inner layer W/S: 4/3.5mil Thickness: 1.6mm Min. hole diameter: 0.2mm Special process: Blind & Buried Vias Advantages Of 14 Layer PCB Own lamination process to convenient production for ...
Xinfeng Huihe Circuits Co., Ltd. [Electronic Components & Supplies] [Electronic Data Systems] [2023-02-08 10:06:26 ]
Number of layers: 12 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 7/4mil Inner layer W/S: 5/4mil Thickness:1.5mm Min. hole diameter: 0.25mm Special process: Blind Vias Advantages Of 12 Layer PCB Own lamination process to convenient production for Multilayer PCB and ...
Xinfeng Huihe Circuits Co., Ltd. [Electronic Components & Supplies] [Electronic Data Systems] [2023-02-08 10:06:11 ]
Number of layers: 10 Surface finish: ENIG Base material: FR4 W/S: 4/4mil Thickness: 1.6mm Min. hole diameter: 0.2mm Special process: Blind Vias Advantages Of 10 Layer ENIG Blind Vias PCB Own lamination process to convenient production for Multilayer PCB and shorten the lead ...
Xinfeng Huihe Circuits Co., Ltd. [Electronic Components & Supplies] [Electronic Data Systems] [2023-02-08 10:05:55 ]
Number of layers: 4 Surface finish: ENIG Base material: High TG FR4 Outer Layer W/S: 4/3.5mil Inner layer W/S: 4/3.5mil Thickness: 1.0mm Min. hole diameter: 0.25mm Special process: Impedance Control Advantages Of 4 Layer High TG Impedance Control Fine Pitch PCB Own lamination ...
Xinfeng Huihe Circuits Co., Ltd. [Electronic Components & Supplies] [Electronic Data Systems] [2022-10-20 09:31:30 ]
Number of layers: rogers fr4 size：80*88mm Surface finish: ENIG Base material: FR4+Rogers 4350B Min. hole diameter: 0.3mm Minimum Line Width：0.230mm Minimum Line Space：0.170mm Thickness: 1.0mm Advantages Of 4 Layer rogers fr4 pcb Own lamination process to convenient ...
Xinfeng Huihe Circuits Co., Ltd. [Electronic Components & Supplies] [Electronic Data Systems] [2022-10-20 09:30:40 ]
Number of layers: 2 Surface finish: ENIG Base material: Taconic TLY-5A Min. hole diameter: 0.3mm Outer Layer W: 1.046mil Outer layer S: /mil Thickness: 0.94mm Advantages Of 2 Layer Taconic PCB Own lamination process to convenient production for Multilayer PCB and shorten the ...
Xinfeng Huihe Circuits Co., Ltd. [Electronic Components & Supplies] [Electronic Data Systems] [2022-10-20 09:30:13 ]
Number of layers: 2 size: 184.2*158.9mm Surface finish: LF-HASL Base material: Rogers 4350B Min. hole diameter: 0.4mm Minimum Line Width: 0.227mm Minimum Line Space: 0.127mm Thickness: 0.7mm Advantages Of 2 Layer Rogers LF-HASL PCB Own lamination process to convenient ...
Xinfeng Huihe Circuits Co., Ltd. [Electronic Components & Supplies] [Electronic Data Systems] [2022-10-20 09:29:48 ]
Number of layers: 2 size: 96.45*87.73mm Surface finish: ENIG Base material: Rogers 4350B Min. hole diameter: 0.5mm Minimum Line Width：/mm Minimum Line Space：0.139mm Thickness: 0.35mm Advantages Of 2 Layer Rogers ENIG Rf PCB Own lamination process to convenient production ...
Xinfeng Huihe Circuits Co., Ltd. [Electronic Components & Supplies] [Electronic Data Systems] [2022-10-20 09:29:20 ]
Number of layers: 2 size: 98.45*49.45mm Surface finish: ENIG Base material: Rogers 4350B Min. hole diameter: 0.5mm Minimum Line Width：/mm Minimum Line Space：0.139mm Thickness: 0.35mm Advantages Of 2 Layer Rogers PCB Own lamination process to convenient production for ...
Xinfeng Huihe Circuits Co., Ltd. [Electronic Components & Supplies] [Electronic Data Systems] [2022-10-20 09:28:55 ]
Number of layers: 2 Surface finish: ENIG Base material: F4B Min. hole diameter: 0.8mm Outer Layer W: 6mil Outer layer S: 6mil Thickness: 1.0mm Advantages Of 2 Layer F4B PCB Own lamination process to convenient production for Multilayer PCB and shorten the lead time. Jiangxi ...
Xinfeng Huihe Circuits Co., Ltd. [Electronic Components & Supplies] [Electronic Data Systems] [2022-10-20 09:28:26 ]
Number of layers: 16 Surface finish: ENIG Base material: FR4 Thickness: 3.0mm Min. hole diameter:0.35mm size：420×560mm Outer Layer W/S: 4/3mil Inner layer W/S: 5/4mil Aspect Ratio: 9:1 Special process: via-in-pad Impedance Control Press Fit Hole Advantages Of 16 Layer ENIG ...
Xinfeng Huihe Circuits Co., Ltd. [Electronic Components & Supplies] [Electronic Data Systems] [2022-09-16 09:58:30 ]
Number of layers: 10 Surface finish: ENIG Aspect Ratio: 8:1 Base material: FR4 Outer Layer W/S: 4/4mil Inner layer W/S: 5/3.5mil Thickness: 2.0mm Min. hole diameter:0.25mm Special process: Impedance Control, Resin Plugging, Different Copper Thickness Advantages Of 10 Layer ...
Xinfeng Huihe Circuits Co., Ltd. [Electronic Components & Supplies] [Electronic Data Systems] [2022-09-16 09:57:55 ]
Number of layers: 8 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 4/3.5mil Inner layer W/S: 4/3.5mil Thickness: 1.2mm Min. hole diameter: 0.2mm Special process: impedance control+half hole Advantages Of 8 Layer ENIG Impedance Control Half Hole PCB Own lamination ...
Xinfeng Huihe Circuits Co., Ltd. [Electronic Components & Supplies] [Electronic Data Systems] [2022-04-27 11:12:41 ]
Number of layers: 6 Surface finish: LF-HASL Base material: FR4 Outer Layer W/S: 11/6mil Inner layer W/S: 16/5mil Thickness: 1.6mm Min. hole diameter: 0.3mm Advantages Of 6 layer pcb Own lamination process to convenient production for Multilayer PCB and shorten the lead time. ...
Xinfeng Huihe Circuits Co., Ltd. [Electronic Components & Supplies] [Electronic Data Systems] [2022-04-27 11:11:49 ]
Number of layers: 6 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 4/2mil Inner layer W/S: 4/3mil Thickness: 1.6mm Min. hole diameter: 0.15mm Advantages Of pcb 6 layer Own lamination process to convenient production for Multilayer PCB and shorten the lead time. ...
Xinfeng Huihe Circuits Co., Ltd. [Electronic Components & Supplies] [Electronic Data Systems] [2022-04-27 11:11:00 ]
Number of layers: 6 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 4/2.5mil Inner layer W/S: 4.5/4.5mil Thickness: 1.0mm Min. hole diameter: 0.2mm Special process: impedance control Advantages Of 6 Layer ENIG Impedance Control PCB Bare Board Own lamination process to ...
Xinfeng Huihe Circuits Co., Ltd. [Electronic Components & Supplies] [Electronic Data Systems] [2022-04-27 11:09:51 ]
12 Layers PCB Board for Power Product Details Product: 12 Layers PCB Board Surface Finished: ENIG Board Thickness: 3.8mm Solder Mask: Green Layer: 12 Layers Material: FR4-Tg170 Useful: Power Products pcboardfactory@sina.com ...
Yheng Circuit Board Electronic Co., Ltd / pcboardfactory@sina.com [Electronic Components & Supplies] [Other PCB & PCBA] [2021-02-07 15:31:35 ]
Our Production Capability for PCB Number of Layer: 1 - 20 Layer Maximum Processing Area: 680 × 1000MM Min Board Thickness: 2 Layer - 0.3MM ( 12 mil ) 4 Layer - 0.4MM ( 16 mil ) 6 Layer - 0.8MM ( 32 mil ) 8 Layer - 1.0MM ( 40 mil) 10 Layer - 1.1MM ( 44 mil ) 12 Layer - 1.3MM ( ...
Yheng Circuit Board Electronic Co., Ltd / pcboardfactory@sina.com [Electronic Components & Supplies] [Other PCB & PCBA] [2021-01-27 14:15:41 ]
Welcome to RuoMei – one of the leading manufacturers and suppliers of PCB products in China. Our factory is engaged in PCB manufacturing and offering customized rigid 10 layers gold fingers Au32u” pcb substrate fr4 with 1.6mm board thickness ENIG at competitive price. High ...
Winow New Energy Co.,Limited [Electronic Components & Supplies] [Other PCB & PCBA] [2020-11-26 10:23:09 ]
HDI boards, one of the fastest growing technologies in PCBs, are now available at Eolane SCM. HDI interconnect board contains blind and/or buried vias and often contains microvias of .006 or less in diameter. They have a higher circuitry density than traditional circuit boards. ...
Winow New Energy Co.,Limited [Electronic Components & Supplies] [Other PCB & PCBA] [2020-11-18 14:06:20 ]
